CUI Devices
Product No:
HSS07-C20-P274
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, STAMPING, TO-220, 21.
Quantity:
Please send RFQ , we will respond immediately.

| Mfr | CUI Devices |
| Type | Board Level, Vertical |
| Shape | Rectangular |
| Width | 0.520" (13.21mm) |
| Length | 0.853" (21.66mm) |
| Series | HSS |
| Package | Box |
| Diameter | - |
| Material | Copper Alloy |
| Fin Height | 0.515" (13.08mm) |
| Package Cooled | TO-220 |
| Product Status | Active |
| Material Finish | Tin |
| Attachment Method | PC Pin |
| Thermal Resistance @ Natural | 29.57°C/W |
| Power Dissipation @ Temperature Rise | 2.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 12.60°C/W @ 200 LFM |