HSB01-080808
CUI Devices
Product No:
HSB01-080808
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.335" (8.50mm) |
| Length | 0.335" (8.50mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.315" (8.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive (Not Included) |
| Thermal Resistance @ Natural | 39.10°C/W |
| Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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